| Recent Progress in Low Temperature Curable Photosensitive Dielectric |
2017 International Conference on Electronics Packaging |
2017 |
| Low Temperature Curable PI/PBO for Advanced Packaging |
IMAPS 13th International Conference and Exhibition on Device Packaging |
2017 |
| Low Temperature Curable PI/PBO for Wafer Level Packaging |
The 14th Annual International Wafer Level Packaging Conference |
2017 |
| 低温硬化ポジ型感光性樹脂の高溶解コントラスト化 |
第27回マイクロエレクトロニクスシンポジウム(MES2017)秋季大会 |
2017 |
| Novel 200 deg. C Curable Positive Tone Poly(benzoxazole) Materials |
IEEE CPMT Symposium Japan 2016 |
2016 |
| Low Stress, High Modulus, Photosensitive Polyimide |
Journal of Photopolymer Science and Technology 28(2), 215-218, 2015 |
2015 |
| Improvement in Adhesion Strength of Positive-tone Photo-definable Poly(benzoxazole) Materials |
The 16th Symposium on Polymers for Microelectronics |
2014 |
| Development of Low CHE, Negative-tone, Photo-definable Polyimide for HDD Suspension |
IEEE CPMT Symposium Japan 2012 |
2012 |
| Using permanent and temporary polyimide adhesives in 3D-TSV processing to avoid thin wafer handling |
Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012 |
2012 |
| Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials |
Journal of Photopolymer Science and Technology, 23(4), 477, 2012 |
2012 |
| Development of A Photosensitive PBO with Improved Chemical Resistance |
The 15th Symposium on Polymers for Microelectronics |
2012 |
| 半導体用ストレスバッファー材料の最新動向 |
日本ゴム協会誌 85(2), 40-45, 2012 |
2012 |
| Ultra Low Temperature Curable Positive-tone Photodefinable Poly(benzoxazole)-II |
The 14th Symposium on Polymers for Microelectronics |
2010 |
| 三次元パッケージ技術を施行した高耐熱ポリイミド接着剤と薄ウェーハハンドリングへの適用 |
電子情報通信学会誌C Vol. J95-C, No. 11, 477-482, 2010 |
2010 |
