題目 | 掲載誌・講演会 | 掲載・発表年 |
---|---|---|
Recent Progress in Low Temperature Curable Photosensitive Dielectric | 2017 International Conference on Electronics Packaging | 2017 |
Low Temperature Curable PI/PBO for Advanced Packaging | IMAPS 13th International Conference and Exhibition on Device Packaging | 2017 |
Low Temperature Curable PI/PBO for Wafer Level Packaging | The 14th Annual International Wafer Level Packaging Conference | 2017 |
低温硬化ポジ型感光性樹脂の高溶解コントラスト化 | 第27回マイクロエレクトロニクスシンポジウム(MES2017)秋季大会 | 2017 |
Novel 200 deg. C Curable Positive Tone Poly(benzoxazole) Materials | IEEE CPMT Symposium Japan 2016 | 2016 |
Low Stress, High Modulus, Photosensitive Polyimide | Journal of Photopolymer Science and Technology 28(2), 215-218, 2015 | 2015 |
Improvement in Adhesion Strength of Positive-tone Photo-definable Poly(benzoxazole) Materials | The 16th Symposium on Polymers for Microelectronics | 2014 |
Development of Low CHE, Negative-tone, Photo-definable Polyimide for HDD Suspension | IEEE CPMT Symposium Japan 2012 | 2012 |
Using permanent and temporary polyimide adhesives in 3D-TSV processing to avoid thin wafer handling | Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012 | 2012 |
Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials | Journal of Photopolymer Science and Technology, 23(4), 477, 2012 | 2012 |
Development of A Photosensitive PBO with Improved Chemical Resistance | The 15th Symposium on Polymers for Microelectronics | 2012 |
半導体用ストレスバッファー材料の最新動向 | 日本ゴム協会誌 85(2), 40-45, 2012 | 2012 |
Ultra Low Temperature Curable Positive-tone Photodefinable Poly(benzoxazole)-II | The 14th Symposium on Polymers for Microelectronics | 2010 |
三次元パッケージ技術を施行した高耐熱ポリイミド接着剤と薄ウェーハハンドリングへの適用 | 電子情報通信学会誌C Vol. J95-C, No. 11, 477-482, 2010 | 2010 |
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